Crolles
France
53
2024-11-28
The entities that hold a legal rights for patent applications filed by inventor Radu Ionut:
Ionut Radu from Crolles, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
HETEROSTRUCTURE AND METHOD OF FABRICATION
#2 | 2024-01-18Method of mechanical separation for a double layer transfer
#3 | 2023-11-23Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#4 | 2023-08-31Heterostructure and method of fabrication
#5 | 2023-08-17Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC
#6 | 2023-08-10Surface acoustic wave device including transducer in dielectric between a piezoelectric material and a substrate
#7 | 2023-07-06COMPOSITE SUBSTRATES INCLUDING EPITAXIAL MONOCRYSTALLINE PIEZOELECTRIC LAYERS BONDED TO SUBSTRATES, AND ACOUSTIC WAVE DEVICES FORMED WITH SUCH COMPOSITE SUBSTRATES
#8 | 2023-05-25Method for manufacturing a composite structure comprising a thin layer made of monocrystalline SiC on a carrier substrate made of SiC
#9 | 2022-09-01Structures for radiofrequency applications and related methods
#10 | 2021-05-13Structures for radiofrequency applications and related methods
#11 | 2021-04-29Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#12 | 2021-04-22Method of mechanical separation for a double layer transfer
#13 | 2021-02-25Heterostructure and method of fabrication
#14 | 2020-09-17Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit
#15 | 2020-09-03Heterostructure and method of fabrication
#16 | 2020-07-16Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#17 | 2020-05-21Method for locating devices
#18 | 2019-05-23Structure for radiofrequency applications
#19 | 2019-01-03Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#20 | 2019-01-03Method for manufacturing a monocrystalline piezoelectric layer
#21 | 2018-11-01COMPOSITE STRUCTURE AND ASSOCIATED PRODUCTION METHOD
#22 | 2018-10-25Surface acoustic wave device and associated production method
#23 | 2018-06-07Heterostructure and method of fabrication
#24 | 2017-07-20Method for fabricating semiconductor structures including a high resistivity layer, and related semiconductor structures
#25 | 2016-12-08Method of mechanical separation for a double layer transfer
#26 | 2016-07-07METHOD FOR LOCATING DEVICES
#27 | 2016-03-24METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING TRANSISTOR CHANNELS HAVING DIFFERENT STRAIN STATES, AND RELATED SEMICONDUCTOR STRUCTURES
#28 | 2015-12-17Method for transferring a layer comprising a compressive stress layer and related structures
#29 | 2015-10-20Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structures
#30 | 2015-10-01METHOD FOR BONDING SEMICONDUCTOR WAFERS USING A MOLECULAR BONDING APPARATUS
#31 | 2015-08-13Bonded processed semiconductor structures and carriers
#32 | 2015-06-25Method for producing composite structure with metal/metal bonding
#33 | 2014-12-04Process for stabilizing a bonding interface, located within a structure which comprises an oxide layer and structure obtained
#34 | 2013-11-14Methods of forming bonded semiconductor structures
#35 | 2013-10-03Bonded processed semiconductor structures and carriers
#36 | 2013-08-22Methods of providing thin layers of crystalline semiconductor material, and related structures and devices
#37 | 2013-07-11Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods
#38 | 2013-03-28Methods of transferring layers of material in 3D integration processes and related structures and devices
#39 | 2013-02-07Apparatus for manufacturing semiconductor devices
#40 | 2013-01-31Method for curing defects in a semiconductor layer
#41 | 2013-01-31Process for manufacturing a semiconductor structure comprising a functionalized layer on a support substrate
#42 | 2012-10-04Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
#43 | 2012-10-04Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
#44 | 2012-09-27Heterostructure for electronic power components, optoelectronic or photovoltaic components
#45 | 2012-03-22APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#46 | 2012-01-19Preparing a Surface of a Sapphire Substrate for Fabricating Heterostructures
#47 | 2012-01-19Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#48 | 2012-01-19Methods of forming bonded semiconductor structures
#49 | 2011-12-22APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#50 | 2011-08-25Method of detaching semi-conductor layers at low temperature
#51 | 2011-06-02HETEROSTRUCTURE FOR ELECTRONIC POWER COMPONENTS, OPTOELECTRONIC OR PHOTOVOLTAIC COMPONENTS
#52 | 2010-10-21Method for manufacturing heterostructures
#53 | 2008-06-19DOUBLE PLASMA UTBOX
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