Assignee profile:

S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES

City:

Crolles Cedex

Country:

France

Published Applications:

28

Last publication date:

2013-04-18

Patent Grants:

20

Last grant date:

2014-09-23

Top Inventors for applications by S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES

These are the the leading inventors for applications assigned to S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES:

Recent patent applications by S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES

S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES based in Crolles Cedex, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-04-18
US20130093033A9
Electricity

THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAYERS OF MICROCOMPONENTS

#2 | 2013-02-14 βœ… Patent 8,842,945 granted on 2014-09-23
US20130039615A1
Electricity

Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates

#3 | 2013-02-14 βœ… Patent 8,617,925 granted on 2013-12-31
US20130037960A1
Electricity

Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods

#4 | 2013-02-14 βœ… Patent 8,728,863 granted on 2014-05-20
US20130037959A1
Electricity

Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods

#5 | 2013-01-24 βœ… Patent 8,697,493 granted on 2014-04-15
US20130020704A1
Electricity

Bonding surfaces for direct bonding of semiconductor structures

#6 | 2012-10-04 βœ… Patent 8,716,105 granted on 2014-05-06
US20120252189A1
Electricity

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods

#7 | 2012-10-04 βœ… Patent 8,338,294 granted on 2012-12-25
US20120248622A1
Electricity

Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods

#8 | 2012-10-04
US20120248621A1
Electricity

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

#9 | 2012-08-23 βœ… Patent 8,975,165 granted on 2015-03-10
US20120211870A1
Electricity

III-V semiconductor structures with diminished pit defects and methods for forming the same

#10 | 2012-06-28 βœ… Patent 8,637,383 granted on 2014-01-28
US20120161289A1
Electricity

Strain relaxation using metal materials and related structures

#11 | 2012-06-21 βœ… Patent 8,575,001 granted on 2013-11-05
US20120153484A1
Electricity

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

#12 | 2012-04-05 βœ… Patent 8,133,806 granted on 2012-03-13
US20120083101A1
Electricity

Systems and methods for forming semiconductor materials by atomic layer deposition

#13 | 2012-04-05 βœ… Patent 8,486,192 granted on 2013-07-16
US20120083100A1
Electricity

Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods

#14 | 2012-02-02 βœ… Patent 8,932,938 granted on 2015-01-13
US20120028440A1
Electricity

Method of fabricating a multilayer structure with circuit layer transfer

#15 | 2011-12-01 βœ… Patent 8,785,293 granted on 2014-07-22
US20110294245A1
Electricity

Adaptation of the lattice parameter of a layer of strained material

#16 | 2011-12-01 βœ… Patent 9,041,165 granted on 2015-05-26
US20110291247A1
Electricity

Relaxation and transfer of strained material layers

#17 | 2011-11-24
US20110287604A1
Electricity

METHODS OF FORMING SEMICONDUCTOR STRUCTURES COMPRISING DIRECT BONDING OF SUBSTRATES

#18 | 2011-11-17
US20110278691A1
Electricity

THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAYERS OF MICROCOMPONENTS

#19 | 2011-11-17 βœ… Patent 8,614,501 granted on 2013-12-24
US20110278597A1
Electricity

Method of producing a layer of cavities

#20 | 2011-11-03 βœ… Patent 8,507,332 granted on 2013-08-13
US20110266651A1
Electricity

Method for manufacturing components

#21 | 2011-09-29
US20110233719A1
Electricity

TEST METHOD ON THE SUPPORT SUBSTRATE OF A SUBSTRATE OF THE "SEMICONDUCTOR ON INSULATOR" TYPE

#22 | 2011-09-22 βœ… Patent 8,298,916 granted on 2012-10-30
US20110230003A1
Electricity

Process for fabricating a multilayer structure with post-grinding trimming

#23 | 2011-08-11
US20110195560A1
Electricity

METHOD OF PRODUCING A SILICON-ON-SAPPHIRE TYPE HETEROSTRUCTURE

#24 | 2011-08-11
US20110193201A1
Electricity

METHOD TO FABRICATE AND TREAT A STRUCTURE OF SEMICONDUCTOR-ON-INSULATOR TYPE, ENABLING DISPLACEMENT OF DISLOCATIONS, AND CORRESPONDING STRUCTURE

#25 | 2011-07-28
US20110183493A1
Electricity

PROCESS FOR MANUFACTURING A STRUCTURE COMPRISING A GERMANIUM LAYER ON A SUBSTRATE

#26 | 2011-05-19 βœ… Patent 8,114,754 granted on 2012-02-14
US20110114965A1
Electricity

Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods

#27 | 2008-07-24 βœ… Patent 7,807,548 granted on 2010-10-05
US20080176382A1
Performing operations; transporting

Process of forming and controlling rough interfaces

#28 | 2008-07-24 βœ… Patent 8,268,703 granted on 2012-09-18
US20080176381A1
Performing operations; transporting

Surface roughening process

AssigneeID:

5534 ⎘