Daejeon-si
South Korea
11
2013-01-31
The entities that hold a legal rights for patent applications filed by inventor Chi HeeJo:
HeeJo Chi from Daejeon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
#2 | 2012-02-16Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
#3 | 2011-12-08Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
#4 | 2010-11-04Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
#5 | 2010-10-14Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
#6 | 2010-09-30Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
#7 | 2010-09-23Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site
#8 | 2010-09-23Integrated circuit packaging system with an interposer and method of manufacture thereof
#9 | 2010-09-23INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
#10 | 2010-09-09Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof
#11 | 2008-12-25INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE
61422 ⎘