Taichung
Taiwan
26
2018-08-30
The entities that hold a legal rights for patent applications filed by inventor Sun Ming-Chen:
Ming-Chen Sun from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#2 | 2017-12-07Method of fabricating package structure with an embedded electronic component
#3 | 2017-10-26Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
#4 | 2017-10-19FABRICATION METHOD OF PACKAGE STRUCTURE
#5 | 2017-10-05Method of fabricating semiconductor package structure
#6 | 2017-08-17Method of manufacturing package substrate and semiconductor package
#7 | 2017-02-16Fabrication method of coreless packaging substrate
#8 | 2016-06-09Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
#9 | 2016-06-02Package substrate, semiconductor package and method of manufacturing the same
#10 | 2016-03-24PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
#11 | 2016-03-17Semiconductor package structure and method of fabricating the same
#12 | 2016-03-17Package structure with an embedded electronic component and method of fabricating the package structure
#13 | 2016-03-10SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#14 | 2016-01-21Coreless packaging substrate and fabrication method thereof
#15 | 2016-01-14PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
#16 | 2015-12-03Package structure and fabrication method thereof
#17 | 2015-11-19PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
#18 | 2015-11-12CORELESS PACKAGING SUBSTRATE, POP STRUCTURE, AND METHODS FOR FABRICATING THE SAME
#19 | 2015-10-22Method of fabricating a packaging substrate including a carrier having two carrying portions
#20 | 2015-10-08Package structure having a laminated release layer and method for fabricating the same
#21 | 2015-04-16PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
#22 | 2014-10-16Fabrication method of semiconductor package
#23 | 2013-11-21Semiconductor package and fabrication method thereof
#24 | 2013-09-05SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF
#25 | 2013-01-31SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#26 | 2012-12-27Semiconductor package and fabrication method thereof
61432 ⎘