Ron Iwata

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2009-02-19

Top Assignees for applications by Ron Iwata

The entities that hold a legal rights for patent applications filed by inventor Iwata Ron:

Ron Iwata from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

InventorID:

6168729 ⎘