Wilhelm Lapointe

City:

Richmond, Vermont

Country:

United States

Published Applications:

Last publication date:

2008-08-07

Top Assignees for applications by Wilhelm Lapointe

The entities that hold a legal rights for patent applications filed by inventor Lapointe Wilhelm:

Wilhelm Lapointe from Richmond, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Apparatus and method for semiconductor wafer bumping via injection molded solder

InventorID:

6197128 ⎘