SUSS MICROTEC AG

City:

GARCHING/MUNICH

Country:

Germany

Published Applications:

Last publication date:

2008-11-20

Patent Grants:

Last grant date:

2009-11-03

Top Inventors for applications by SUSS MICROTEC AG

These are the the leading inventors for applications assigned to SUSS MICROTEC AG:

HALE JOHNSON 3 JERICHO, VT United States
G. Gerard GORMLEY 3 Worcester, VT United States
Wilhelm Lapointe 1 Richmond, VT United States
EMMETT HUGHLETT 1 WATERBURY, VT United States

WILHELM LAPOINTE 1 RICHMONT, VT United States
MARKUS GABRIEL 1 GARCHING/MUNICH, Germany
MATTHEW STILES 1 WATERBURY, VT United States
PATRICK GORUN 1 BURLINGTON, VT United States

MICHAEL DAVIDSON 1 WOLCOTT, VT United States

Recent patent applications by SUSS MICROTEC AG

SUSS MICROTEC AG based in GARCHING/MUNICH, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-11-20 ✅ Patent 7,612,895 granted on 2009-11-03

US20080285059A1

Electricity

Apparatus and method for in-situ monitoring of wafer bonding time

#2 | 2008-10-02 ✅ Patent 7,703,658 granted on 2010-04-27

US20080237315A1

Performing operations; transporting

Apparatus and method for semiconductor wafer bumping via injection molded solder

#3 | 2008-08-07 ✅ Patent 7,732,320 granted on 2010-06-08

US20080188072A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

#4 | 2008-08-07 ✅ Patent 7,790,596 granted on 2010-09-07

US20080188070A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

#5 | 2008-08-07 ✅ Patent 8,088,684 granted on 2012-01-03

US20080188069A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

AssigneeID:

267944 ⎘