Durham, North Carolina
United States
36
2024-02-22
The entities that hold a legal rights for patent applications filed by inventor ANDREWS PETER:
PETER ANDREWS from Durham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METALLIC LAYER FOR DIMMING LIGHT-EMITTING DIODE CHIPS
#2 | 2022-08-18Solid-state light emitting device with improved color emission
#3 | 2021-11-25Multi-layer conversion material for down conversion in solid state lighting
#4 | 2018-08-23Solid state lighting component package with conformal reflective coating
#5 | 2015-07-16WAFER LEVEL CONTACT PAD STANDOFFS WITH INTEGRATED REFLECTOR
#6 | 2015-05-14UNIFORM EMISSION LED PACKAGE
#7 | 2014-12-18Multi-layer conversion material for down conversion in solid state lighting
#8 | 2014-12-11SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER
#9 | 2014-11-27Solid state lighting component package with conformal reflective coating
#10 | 2014-10-23LED assembly
#11 | 2014-01-23Solid state lighting component package with reflective polymer matrix layer
#12 | 2012-08-02Solid state lighting component package with reflective layer
#13 | 2012-06-07Semiconductor light emitting devices and submounts
#14 | 2011-07-28Packaged light emitting devices
#15 | 2011-03-03Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
#16 | 2010-10-07LED package with increased feature sizes
#17 | 2009-06-25Methods for forming semiconductor light emitting devices and submounts
#18 | 2008-08-14Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
#19 | 2008-05-01Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
#20 | 2008-04-17Reflector packages and semiconductor light emitting devices including the same
#21 | 2008-04-03Method of uniform phosphor chip coating and LED package fabricated using method
#22 | 2008-01-03LED package with flexible polyimide circuit and method of manufacturing LED package
#23 | 2007-12-20Packaged light emitting devices
#24 | 2007-10-04Uniform emission LED package
#25 | 2007-07-26Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
#26 | 2007-07-19Dispensed electrical interconnections
#27 | 2007-02-08Packages for semiconductor light emitting devices utilizing dispensed encapsulants
#28 | 2007-02-01Methods, apparatus and computer program products for controlling a volume of liquid in semiconductor processing based on reflected optical radiation
#29 | 2006-11-30Fluid-dispensing apparatus with controlled tear-off
#30 | 2006-04-13Trench cut light emitting diodes and methods of fabricating same
#31 | 2006-03-23Methods of assembly for a semiconductor light emitting device package
#32 | 2006-02-07Trench cut light emitting diodes and methods of fabricating same
#33 | 2005-10-06Methods for packaging of a semiconductor light emitting device
#34 | 2005-10-06Method for packaging a light emitting device by one dispense then cure step followed by another
#35 | 2005-06-16Semiconductor substrate assemblies and methods for preparing and dicing the same
#36 | 2005-06-09Semiconductor light emitting devices and submounts
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