Rainer Tilgner

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2010-02-18

Top Assignees for applications by Rainer Tilgner

The entities that hold a legal rights for patent applications filed by inventor Tilgner Rainer:

Rainer Tilgner from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck

InventorID:

6224190 ⎘