Wan Lay Looi

City:

Johor

Country:

Malaysia

Published Applications:

Last publication date:

2007-05-24

Top Assignees for applications by Wan Lay Looi

The entities that hold a legal rights for patent applications filed by inventor Looi Wan Lay:

Wan Lay Looi from Johor, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit package system with bump pad

InventorID:

6228993 ⎘