Bo Sun

City:

Pingihen

Country:

Taiwan

Published Applications:

Last publication date:

2008-12-25

Top Assignees for applications by Bo Sun

The entities that hold a legal rights for patent applications filed by inventor Sun Bo:

Bo Sun from Pingihen, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Thin double-sided package substrate and manufacture method thereof

InventorID:

6229742 ⎘