Michael Bennett Cohn

City:

Berkeley, California

Country:

United States

Published Applications:

Last publication date:

2012-08-02

Top Assignees for applications by Michael Bennett Cohn

The entities that hold a legal rights for patent applications filed by inventor Cohn Michael Bennett:

MicroAssembly Technologies, Inc. 3 Richmond, CA United States

Recent patent applications by Cohn Michael Bennett

Michael Bennett Cohn from Berkeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-02

US20120193754A1

Electricity

MEMS device with integral packaging

#2 | 2010-07-06

US11929115

Microelectromechanical systems using thermocompression bonding

#3 | 2008-11-06

US20080272867A1

Electricity

MEMS device with integral packaging

InventorID:

6252349 ⎘