🔗 Permalink

Inventor profile of:

Andrey Grinman

City:

Jerusalem

Country:

Israel

Published Applications:

Last publication date:

2015-12-31

Top Assignees for applications by Andrey Grinman

The entities that hold a legal rights for patent applications filed by inventor Grinman Andrey:

TESSERA INC. 8 San Jose, CA United States
Tessera Technologies Hungary Kft. 3 Budapest, Hungary
Tessera Technologies Hungary Kft. 1 , Hungary
Tessera Technologies Ireland Limited 1 , Ireland

Recent patent applications by Grinman Andrey

Andrey Grinman from Jerusalem, IL has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-12-31

US20150380336A1

Electricity

Packaged semiconductor chips with array

#2 | 2014-06-05

US20140151881A1

Electricity

Packaged semiconductor chips with array

#3 | 2014-01-30

US20140027931A1

Electricity

STACK PACKAGES USING RECONSTITUTED WAFERS

#4 | 2012-06-21

US20120153443A1

Electricity

Packaged semiconductor chips with array

#5 | 2011-10-13

US20110248410A1

Electricity

Stack packages using reconstituted wafers

#6 | 2011-01-20

US20110012259A1

Electricity

Packaged semiconductor chips

#7 | 2008-05-22

US20080116545A1

Electricity

Packaged semiconductor chips

#8 | 2008-05-22

US20080116544A1

Electricity

Packaged semiconductor chips with array

#9 | 2008-05-01

US20080099907A1

Electricity

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

#10 | 2007-08-16

US20070190747A1

Performing operations; transporting

Wafer level packaging to lidded chips

#11 | 2007-08-16

US20070190691A1

Performing operations; transporting

Wafer level chip packaging

InventorID:

628059 ⎘