Jun Oyabu

City:

Nirasaki

Country:

Japan

Published Applications:

Last publication date:

2014-02-20

Top Assignees for applications by Jun Oyabu

The entities that hold a legal rights for patent applications filed by inventor Oyabu Jun:

Jun Oyabu from Nirasaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Substrate processing apparatus

Method of setting thickness of dielectric and substrate processing apparatus having dielectric disposed in electrode

Substrate processing method and substrate processing apparatus

InventorID:

6285744 ⎘