Inventor profile of:

Yonghwan Kwon

City:

Suwon-si

Country:

South Korea

Published Applications:

17

Last publication date:

2025-09-04

Top Assignees for applications by Yonghwan Kwon

The entities that hold a legal rights for patent applications filed by inventor Kwon Yonghwan:

Recent patent applications by Kwon Yonghwan

Yonghwan Kwon from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-04
US20250278234A1
Physics

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING ELECTRONIC DEVICE

#2 | 2025-08-14
US20250258542A1
Physics

ELECTRONIC DEVICE AND METHOD FOR PROVIDING UI THEREOF

#3 | 2024-03-28
US20240105541A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

#4 | 2024-02-15
US20240055362A1
Electricity

SEMICONDUCTOR PACKAGE

#5 | 2023-12-14
US20230400972A1
Physics

Electronic apparatus and controlling method thereof

#6 | 2021-07-08
US20210208837A1
Physics

Display apparatus and method of controlling the same

#7 | 2021-06-17
US20210183785A1
Electricity

Semiconductor package

#8 | 2019-05-30
US20190164942A1
Electricity

Semiconductor package and method of fabricating the same

#9 | 2017-07-20
US20170207201A1
Electricity

Method for fabricating fan-out wafer level package and fan-out wafer level package fabricated thereby

#10 | 2017-07-06
US20170194266A1
Electricity

Semiconductor package and method for fabricating the same

#11 | 2017-06-15
US20170170154A1
Electricity

Semiconductor package and method of fabricating the same

#12 | 2016-04-28
US20160118326A1
Electricity

Method for fabricating fan-out wafer level package and fan-out wafer level package fabricated thereby

#13 | 2014-08-07
US20140217580A1
Electricity

Semiconductor device including a solder and method of fabricating the same

#14 | 2014-02-20
US20140051243A1
Electricity

Package for semiconductor device including guide rings and manufacturing method of the same

#15 | 2014-02-06
US20140035131A1
Electricity

Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections

#16 | 2012-03-29
US20120074566A1
Electricity

Package for semiconductor device including guide rings and manufacturing method of the same

#17 | 2011-06-09
US20110133333A1
Electricity

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

InventorID:

637731 ⎘