Michael Bauer

City:

Undorf

Country:

Germany

Published Applications:

Last publication date:

2014-02-06

Top Assignees for applications by Michael Bauer

The entities that hold a legal rights for patent applications filed by inventor Bauer Michael:

Michael Bauer from Undorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip package and a method for manufacturing a chip package

InventorID:

637752 ⎘