Kenji Suzuki

City:

Nirasaki

Country:

Japan

Published Applications:

Last publication date:

2022-09-15

Top Assignees for applications by Kenji Suzuki

The entities that hold a legal rights for patent applications filed by inventor Suzuki Kenji:

Kenji Suzuki from Nirasaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of forming tungsten film and system therefor

Method of manufacturing semiconductor device

Deposition device and deposition method

Copper wiring forming method with Ru liner and Cu alloy fill

Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring

InventorID:

6402178 ⎘