Tomohiro Horio

City:

Itoshima

Country:

Japan

Published Applications:

Last publication date:

2014-08-14

Top Assignees for applications by Tomohiro Horio

The entities that hold a legal rights for patent applications filed by inventor Horio Tomohiro:

Tomohiro Horio from Itoshima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Buffer material for packing wafer carrier

InventorID:

6407053 ⎘