Thomas J. Strothmann

City:

Tuscon, Arizona

Country:

United States

Published Applications:

Last publication date:

2015-08-27

Top Assignees for applications by Thomas J. Strothmann

The entities that hold a legal rights for patent applications filed by inventor Strothmann Thomas J.:

STATS CHIPPAC, LTD. 1 Singapore, Singapore
STATS ChipPAC Pte Ltd. 1 Singapore, Singapore

Recent patent applications by Strothmann Thomas J.

Thomas J. Strothmann from Tuscon, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-08-27

US20150243575A1

Electricity

Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)

InventorID:

6431135 ⎘