Inventor profile of:

Muhammad M. RASHEED

City:

San Jose, California

Country:

United States

Published Applications:

58

Last publication date:

2025-12-11

Top Assignees for applications by Muhammad M. RASHEED

The entities that hold a legal rights for patent applications filed by inventor RASHEED Muhammad M.:

Recent patent applications by RASHEED Muhammad M.

Muhammad M. RASHEED from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-11
US20250376766A1
Chemistry; metallurgy

VAPOR DEPOSITION CHAMBER WITH IN-SITU FLOW CONDUCTANCE OPTIMIZATION

#2 | 2023-11-09
US20230357927A1
Chemistry; metallurgy

ALD cycle time reduction using process chamber lid with tunable pumping

#3 | 2023-09-28
US20230307216A1
Electricity

ENHANCED CHAMBER CLEAN AND RECOVERY WITH DUAL FLOW PATH

#4 | 2023-04-27
US20230125613A1
Electricity

Heater cover plate for uniformity improvement

#5 | 2023-01-19
US20230015613A1
Chemistry; metallurgy

High temperature vacuum seal

#6 | 2022-12-08
US20220389585A1
Chemistry; metallurgy

High temperature chemical vapor deposition lid

#7 | 2022-11-17
US20220364575A1
Mechanical engineering

Pumping liner for improved flow uniformity

#8 | 2022-11-10
US20220356572A1
Chemistry; metallurgy

Pumping Liners with Self-Adjusting Pumping Conductance

#9 | 2022-10-27
US20220344134A1
Electricity

Process kit for a substrate support

#10 | 2022-05-26
US20220162752A1
Chemistry; metallurgy

Methods and apparatus to reduce pressure fluctuations in an ampoule of a chemical delivery system

#11 | 2022-03-03
US20220064785A1
Chemistry; metallurgy

APPARATUS AND METHODS FOR GAS PHASE PARTICLE REDUCTION

#12 | 2022-02-10
US20220042617A1
Mechanical engineering

Valve for varying flow conductance under vacuum

#13 | 2021-12-30
US20210404059A1
Chemistry; metallurgy

PROCESSING SYSTEM AND METHOD OF CONTROLLING CONDUCTANCE IN A PROCESSING SYSTEM

#14 | 2021-12-23
US20210395892A1
Chemistry; metallurgy

High temperature chemical vapor deposition lid

#15 | 2021-11-04
US20210343557A1
Electricity

Heater cover plate for uniformity improvement

#16 | 2021-10-14
US20210317577A1
Chemistry; metallurgy

High temperature vacuum seal

#17 | 2021-08-26
US20210262092A1
Chemistry; metallurgy

SEQUENTIAL PULSE AND PURGE FOR ALD PROCESSES

#18 | 2021-08-12
US20210246552A1
Chemistry; metallurgy

Lids and lid assembly kits for atomic layer deposition chambers

#19 | 2021-07-29
US20210231242A1
Mechanical engineering

Apparatus and methods to prevent particle entry into gas lines

#20 | 2021-06-24
US20210187521A1
Performing operations; transporting

Showerhead for ALD precursor delivery

#21 | 2021-05-06
US20210130953A1
Chemistry; metallurgy

Process kit for improving edge film thickness uniformity on a substrate

#22 | 2021-03-25
US20210087686A1
Chemistry; metallurgy

ALD cycle time reduction using process chamber lid with tunable pumping

#23 | 2020-12-03
US20200378402A1
Mechanical engineering

Pumping liner for improved flow uniformity

#24 | 2020-12-03
US20200377998A1
Chemistry; metallurgy

APPARATUS FOR IMPROVED FLOW CONTROL IN PROCESS CHAMBERS

#25 | 2020-11-12
US20200357616A1
Electricity

HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMITY AND STEP-COVERAGE OF THIS PROCESS

#26 | 2020-03-19
US20200087789A1
Chemistry; metallurgy

Apparatus for multi-flow precursor dosage

#27 | 2019-12-26
US20190390337A1
Chemistry; metallurgy

High temperature rotation module for a processing chamber

#28 | 2019-07-25
US20190229007A1
Electricity

Process kit for a substrate support

#29 | 2019-03-14
US20190078725A1
Mechanical engineering

Gimbal assembly for heater pedestal

#30 | 2019-03-14
US20190078205A1
Chemistry; metallurgy

Apparatus and method for providing a uniform flow of gas

#31 | 2019-02-14
US20190048467A1
Chemistry; metallurgy

SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME

#32 | 2019-01-31
US20190032210A1
Chemistry; metallurgy

Quick disconnect resistance temperature detector assembly for rotating pedestal

#33 | 2018-12-13
US20180358768A1
Electricity

Slip ring for use in rotatable substrate support

#34 | 2018-06-07
US20180155838A1
Chemistry; metallurgy

Process kit design for in-chamber heater and wafer rotating mechanism

#35 | 2017-12-07
US20170350001A1
Chemistry; metallurgy

Sputtering target for PVD chamber

#36 | 2017-10-05
US20170283947A1
Chemistry; metallurgy

Apparatus and method for providing a uniform flow of gas

#37 | 2017-02-02
US20170029941A1
Chemistry; metallurgy

High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process

#38 | 2016-11-03
US20160319428A1
Chemistry; metallurgy

Oxidized showerhead and process kit parts and methods of using same

#39 | 2016-10-27
US20160312360A1
Chemistry; metallurgy

Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate

#40 | 2016-04-07
US20160097119A1
Chemistry; metallurgy

Atomic layer deposition chamber with thermal lid

#41 | 2016-02-25
US20160052772A1
Performing operations; transporting

Methods and apparatus for liquid chemical delivery

#42 | 2015-12-03
US20150345019A1
Chemistry; metallurgy

METHOD AND APPARATUS FOR IMPROVING GAS FLOW IN A SUBSTRATE PROCESSING CHAMBER

#43 | 2015-07-23
US20150203960A1
Chemistry; metallurgy

Target retaining apparatus

#44 | 2015-06-18
US20150170888A1
Electricity

Physical vapor deposition (PVD) target having low friction pads

#45 | 2015-03-19
US20150075980A1
Electricity

Extended dark space shield

#46 | 2014-09-18
US20140262763A1
Electricity

Selectively groundable cover ring for substrate process chambers

#47 | 2014-08-28
US20140238843A1
Electricity

Variable radius dual magnetron

#48 | 2014-04-24
US20140110248A1
Chemistry; metallurgy

CHAMBER PASTING METHOD IN A PVD CHAMBER FOR REACTIVE RE-SPUTTERING DIELECTRIC MATERIAL

#49 | 2014-02-13
US20140042016A1
Electricity

Low resistivity tungsten PVD with enhanced ionization and RF power coupling

#50 | 2012-08-23
US20120211354A1
Electricity

Uniformity tuning capable ESC grounding kit for RF PVD chamber

#51 | 2012-08-09
US20120199469A1
Chemistry; metallurgy

PVD sputtering target with a protected backing plate

#52 | 2011-12-15
US20110303960A1
Electricity

Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming

#53 | 2011-09-01
US20110209995A1
Electricity

Physical Vapor Deposition With A Variable Capacitive Tuner and Feedback Circuit

#54 | 2011-02-17
US20110036709A1
Electricity

PROCESS KIT FOR RF PHYSICAL VAPOR DEPOSITION

#55 | 2010-10-07
US20100252417A1
Electricity

HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMITY AND STEP-COVERAGE OF THIS PROCESS

#56 | 2010-10-07
US20100252416A1
Chemistry; metallurgy

Sputtering target for PVD chamber

#57 | 2010-02-25
US20100048028A1
Chemistry; metallurgy

Surface treated aluminum nitride baffle

#58 | 2009-03-12
US20090068433A1
Chemistry; metallurgy

Ceramic cover wafers of aluminum nitride or beryllium oxide

InventorID:

646659 ⎘