San Jose, California
United States
58
2025-12-11
The entities that hold a legal rights for patent applications filed by inventor RASHEED Muhammad M.:
Muhammad M. RASHEED from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
VAPOR DEPOSITION CHAMBER WITH IN-SITU FLOW CONDUCTANCE OPTIMIZATION
#2 | 2023-11-09ALD cycle time reduction using process chamber lid with tunable pumping
#3 | 2023-09-28ENHANCED CHAMBER CLEAN AND RECOVERY WITH DUAL FLOW PATH
#4 | 2023-04-27Heater cover plate for uniformity improvement
#5 | 2023-01-19High temperature vacuum seal
#6 | 2022-12-08High temperature chemical vapor deposition lid
#7 | 2022-11-17Pumping liner for improved flow uniformity
#8 | 2022-11-10Pumping Liners with Self-Adjusting Pumping Conductance
#9 | 2022-10-27Process kit for a substrate support
#10 | 2022-05-26Methods and apparatus to reduce pressure fluctuations in an ampoule of a chemical delivery system
#11 | 2022-03-03APPARATUS AND METHODS FOR GAS PHASE PARTICLE REDUCTION
#12 | 2022-02-10Valve for varying flow conductance under vacuum
#13 | 2021-12-30PROCESSING SYSTEM AND METHOD OF CONTROLLING CONDUCTANCE IN A PROCESSING SYSTEM
#14 | 2021-12-23High temperature chemical vapor deposition lid
#15 | 2021-11-04Heater cover plate for uniformity improvement
#16 | 2021-10-14High temperature vacuum seal
#17 | 2021-08-26SEQUENTIAL PULSE AND PURGE FOR ALD PROCESSES
#18 | 2021-08-12Lids and lid assembly kits for atomic layer deposition chambers
#19 | 2021-07-29Apparatus and methods to prevent particle entry into gas lines
#20 | 2021-06-24Showerhead for ALD precursor delivery
#21 | 2021-05-06Process kit for improving edge film thickness uniformity on a substrate
#22 | 2021-03-25ALD cycle time reduction using process chamber lid with tunable pumping
#23 | 2020-12-03Pumping liner for improved flow uniformity
#24 | 2020-12-03APPARATUS FOR IMPROVED FLOW CONTROL IN PROCESS CHAMBERS
#25 | 2020-11-12HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMITY AND STEP-COVERAGE OF THIS PROCESS
#26 | 2020-03-19Apparatus for multi-flow precursor dosage
#27 | 2019-12-26High temperature rotation module for a processing chamber
#28 | 2019-07-25Process kit for a substrate support
#29 | 2019-03-14Gimbal assembly for heater pedestal
#30 | 2019-03-14Apparatus and method for providing a uniform flow of gas
#31 | 2019-02-14SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME
#32 | 2019-01-31Quick disconnect resistance temperature detector assembly for rotating pedestal
#33 | 2018-12-13Slip ring for use in rotatable substrate support
#34 | 2018-06-07Process kit design for in-chamber heater and wafer rotating mechanism
#35 | 2017-12-07Sputtering target for PVD chamber
#36 | 2017-10-05Apparatus and method for providing a uniform flow of gas
#37 | 2017-02-02High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process
#38 | 2016-11-03Oxidized showerhead and process kit parts and methods of using same
#39 | 2016-10-27Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate
#40 | 2016-04-07Atomic layer deposition chamber with thermal lid
#41 | 2016-02-25Methods and apparatus for liquid chemical delivery
#42 | 2015-12-03METHOD AND APPARATUS FOR IMPROVING GAS FLOW IN A SUBSTRATE PROCESSING CHAMBER
#43 | 2015-07-23Target retaining apparatus
#44 | 2015-06-18Physical vapor deposition (PVD) target having low friction pads
#45 | 2015-03-19Extended dark space shield
#46 | 2014-09-18Selectively groundable cover ring for substrate process chambers
#47 | 2014-08-28Variable radius dual magnetron
#48 | 2014-04-24CHAMBER PASTING METHOD IN A PVD CHAMBER FOR REACTIVE RE-SPUTTERING DIELECTRIC MATERIAL
#49 | 2014-02-13Low resistivity tungsten PVD with enhanced ionization and RF power coupling
#50 | 2012-08-23Uniformity tuning capable ESC grounding kit for RF PVD chamber
#51 | 2012-08-09PVD sputtering target with a protected backing plate
#52 | 2011-12-15Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming
#53 | 2011-09-01Physical Vapor Deposition With A Variable Capacitive Tuner and Feedback Circuit
#54 | 2011-02-17PROCESS KIT FOR RF PHYSICAL VAPOR DEPOSITION
#55 | 2010-10-07HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMITY AND STEP-COVERAGE OF THIS PROCESS
#56 | 2010-10-07Sputtering target for PVD chamber
#57 | 2010-02-25Surface treated aluminum nitride baffle
#58 | 2009-03-12Ceramic cover wafers of aluminum nitride or beryllium oxide
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