Apex, North Carolina
United States
30
2025-11-13
The entities that hold a legal rights for patent applications filed by inventor Rinne Glenn:
Glenn Rinne from Apex, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
#2 | 2025-05-22ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF
#3 | 2024-08-08SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4 | 2022-06-09SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
#5 | 2022-05-19Method and system for packing optimization of semiconductor devices
#6 | 2021-11-25Semiconductor device and manufacturing method thereof
#7 | 2021-02-11Electronic device with top side pin array and manufacturing method thereof
#8 | 2020-11-12Method and system for packing optimization of semiconductor devices
#9 | 2020-06-25Semiconductor device using EMC wafer support system and fabricating method thereof
#10 | 2020-06-18Semiconductor device and manufacturing method thereof
#11 | 2019-09-12Electronic device with top side pin array and manufacturing method thereof
#12 | 2019-04-11Electronic device with top side pin array and manufacturing method thereof
#13 | 2018-12-27Manufacturing method of semiconductor device and semiconductor device thereof
#14 | 2018-11-08Semiconductor device and method of manufacturing thereof
#15 | 2018-08-30Method and system for packing optimization of semiconductor devices
#16 | 2018-05-22Semiconductor device and manufacturing method
#17 | 2018-05-17Semiconductor device and method of manufacturing thereof
#18 | 2018-04-12Manufacturing method of semiconductor device and semiconductor device thereof
#19 | 2018-02-15Method and System for Packing Optimization of Semiconductor Devices
#20 | 2017-09-21Semiconductor device using EMC wafer support system and fabricating method thereof
#21 | 2017-06-08Transient interface gradient bonding for metal bonds
#22 | 2017-04-27Manufacturing method of semiconductor device and semiconductor device thereof
#23 | 2016-11-03Semiconductor package and manufacturing method thereof
#24 | 2016-02-25Manufacturing method of semiconductor device and semiconductor device thereof
#25 | 2015-11-26Copper pillar sidewall protection
#26 | 2015-02-12Semiconductor package and fabricating method thereof
#27 | 2014-05-29Semiconductor device using EMC wafer support system and fabricating method thereof
#28 | 2014-02-13Semiconductor package and manufacturing method thereof
#29 | 2009-08-27Solder structures including barrier layers with nickel and/or copper
#30 | 2006-02-09Methods of forming lead free solder bumps
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