Seoul
South Korea
7
2024-12-05
The entities that hold a legal rights for patent applications filed by inventor Kwon Jae Doo:
Jae Doo Kwon from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
#2 | 2023-03-16Semiconductor package having routable encapsulated conductive substrate and method
#3 | 2020-08-13Semiconductor package having routable encapsulated conductive substrate and method
#4 | 2018-11-08Semiconductor package having routable encapsulated conductive substrate and method
#5 | 2017-03-09Semiconductor package having routable encapsulated conductive substrate and method
#6 | 2015-10-01Lead frame package having discharge hole and method of manufacturing the same
#7 | 2014-02-13Lead frame package having discharge holes and method of manufacturing the same
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