Bernhardswald
Germany
32
2024-04-11
The entities that hold a legal rights for patent applications filed by inventor Weidgans Bernhard:
Bernhard Weidgans from Bernhardswald, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF PRODUCING THE SEMICONDUCTOR DIE
#2 | 2023-06-08OPTOELECTRONIC ASSEMBLY
#3 | 2022-07-07Semiconductor device including a solder compound containing a compound Sn/Sb
#4 | 2021-06-17Semiconductor device power metallization layer with stress-relieving heat sink structure
#5 | 2020-04-09Barrier for power metallization in semiconductor devices
#6 | 2020-04-02Semiconductor device including a solder compound containing a compound Sn/Sb
#7 | 2019-09-05Semiconductor device with compressive interlayer
#8 | 2019-02-28Compressive interlayer having a defined crack-stop edge extension
#9 | 2019-02-07Semiconductor chip and method of processing a semiconductor chip
#10 | 2018-12-20Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#11 | 2018-12-06Semiconductor device with metal structure electrically connected to a conductive structure
#12 | 2018-10-25Semiconductor devices for integration with light emitting chips and modules thereof
#13 | 2017-11-02Multi-layer metal pads
#14 | 2017-09-21Semiconductor devices for integration with light emitting chips and modules thereof
#15 | 2017-05-30Multi-layer metal pads
#16 | 2017-05-18Semiconductor devices for integration with light emitting chips and modules thereof
#17 | 2017-04-20Semiconductor chip device
#18 | 2016-12-29Semiconductor device with metal structure electrically connected to a conductive structure
#19 | 2016-11-22Methods for making a semiconductor chip device
#20 | 2016-07-14Semiconductor chip and method of processing a semiconductor chip
#21 | 2016-06-16Electrolyte, method of forming a copper layer and method of forming a chip
#22 | 2015-11-12Method for processing a semiconductor workpiece and semiconductor workpiece
#23 | 2015-10-15Method for processing a semiconductor workpiece with metallization
#24 | 2015-10-08Conductive pads and methods of formation thereof
#25 | 2015-08-20Metal Deposition with Reduced Stress
#26 | 2015-01-29Conductive pads and methods of formation thereof
#27 | 2014-12-04Method for processing a semiconductor workpiece with metallization
#28 | 2014-10-30Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
#29 | 2014-06-19Semiconductor device comprising a protective structure on a chip backside and method of producing the same
#30 | 2014-05-01Metal Deposition with Reduced Stress
#31 | 2014-02-27Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
#32 | 2014-02-20Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
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