Dublin, California
United States
7
2025-08-14
The entities that hold a legal rights for patent applications filed by inventor JIANG Liu:
Liu JIANG from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Bonding Layers Formed of High Thermal Conductivity Materials
#2 | 2025-04-17POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
#3 | 2024-12-05STRUCTURE AND FABRICATION METHOD OF PERIPHERAL TRANSISTOR WITH EPI-SI CONTACTS IN MEMORY DEVICES
#4 | 2024-07-11INNER SPACER LINER FOR GATE-ALL-AROUND DEVICE
#5 | 2024-07-11INNER SPACER LINER FOR GATE-ALL-AROUND DEVICE
#6 | 2024-06-13MULTILAYER INNER SPACER FOR GATE-ALL-AROUND DEVICE
#7 | 2024-02-29METHODS FOR FORMING ALIGNMENT MARKS
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