Suwon-si
South Korea
36
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor JEE Youngkun:
Youngkun JEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
BONDING HEAD AND SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING THE SAME
#2 | 2026-01-15SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#3 | 2026-01-08SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4 | 2025-11-20SEMICONDUCTOR PACKAGE
#5 | 2025-11-13SEMICONDUCTOR PACKAGE
#6 | 2025-11-13SEMICONDUCTOR PACKAGE
#7 | 2025-11-13SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
#8 | 2025-10-30SEMICONDUCTOR PACKAGE
#9 | 2025-07-10APPARATUS FOR STACKING CHIP
#10 | 2025-06-26SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#11 | 2025-06-05SEMICONDUCTOR PACKAGE
#12 | 2025-05-29SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
#13 | 2025-05-29SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUFACTURING THE SAME
#14 | 2025-05-15SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION THROUGH THERMAL VIAS
#15 | 2025-04-17SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
#16 | 2025-04-17SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS
#17 | 2025-03-27SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#18 | 2025-03-20SEMICONDUCTOR PACKAGE
#19 | 2025-03-13SEMICONDUCTOR PACKAGE
#20 | 2025-03-13SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURING APPARATUS
#21 | 2025-03-06SEMICONDUCTOR PACKAGE
#22 | 2025-03-06SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY
#23 | 2025-01-09SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#24 | 2025-01-09SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#25 | 2025-01-09SEMICONDUCTOR PACKAGE
#26 | 2025-01-02SEMICONDUCTOR PACKAGE
#27 | 2025-01-02SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#28 | 2024-12-26SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#29 | 2024-12-26SEMICONDUCTOR PACKAGE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE
#30 | 2024-12-26SEMICONDUCTOR PACKAGE
#31 | 2024-12-26SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#32 | 2024-12-26SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#33 | 2024-12-26SEMICONDUCTOR PACKAGE
#34 | 2024-12-19SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
#35 | 2024-11-28BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SEMICONDUCTOR DEVICES USING THE SAME
#36 | 2024-03-14SEMICONDUCTOR PACKAGE
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