Pa-Lan Lee

City:

Daegu

Country:

South Korea

Published Applications:

Last publication date:

2014-11-06

Top Assignees for applications by Pa-Lan Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Pa-Lan:

Pa-Lan Lee from Daegu, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip on film package including distributed via plugs

Chip on film package and display device including the same

Chip on film (COF) substrate, COF package and display device including the same

InventorID:

663197 ⎘