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Inventor profile of:

Kyeongbin Lim

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by Kyeongbin Lim

The entities that hold a legal rights for patent applications filed by inventor Lim Kyeongbin:

SAMSUNG ELECTRONICS CO., LTD. 4 Suwon-si, South Korea

Recent patent applications by Lim Kyeongbin

Kyeongbin Lim from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07

US20260130158A1

Electricity

SUBSTRATE BONDING APPARATUS

#2 | 2025-08-07

US20250249545A1

Performing operations; transporting

POLISHING PROCESS APPARATUS

#3 | 2025-07-17

US20250233048A1

Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

#4 | 2025-07-03

US20250219011A1

Electricity

CHUCK FOR WAFER BONDING DEVICE

#5 | 2025-05-01

US20250140588A1

Electricity

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

#6 | 2025-04-24

US20250132185A1

Electricity

COOLING SYSTEM FOR SEMICONDUCTOR EQUIPMENT

#7 | 2025-02-27

US20250070079A1

Electricity

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

#8 | 2025-02-13

US20250054878A1

Electricity

WARPAGE CONTROL

#9 | 2024-09-26

US20240321805A1

Electricity

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

#10 | 2024-08-22

US20240282604A1

Electricity

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SEMICONDUCTOR PROCESSING APPARATUS

#11 | 2024-06-06

US20240186282A1

Electricity

DIE BONDING APPARATUS

#12 | 2024-05-23

US20240170445A1

Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

#13 | 2024-05-02

US20240145416A1

Electricity

SUBSTRATE BONDING METHOD

#14 | 2024-05-02

US20240139972A1

Performing operations; transporting

NON-CONTACT TYPE GRIPPER

InventorID:

6642903 ⎘