Danfeng Yang

City:

JIANGSU

Country:

China

Published Applications:

Last publication date:

2026-01-01

Top Assignees for applications by Danfeng Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Danfeng:

Danfeng Yang from JIANGSU, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

WAFER-SCALE SYSTEM-IN-PACKAGE STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

InventorID:

6661370 ⎘