Wei Wei YONG

City:

Unterhaching

Country:

Germany

Published Applications:

Last publication date:

2024-06-06

Top Assignees for applications by Wei Wei YONG

The entities that hold a legal rights for patent applications filed by inventor YONG Wei Wei:

Wei Wei YONG from Unterhaching, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

CHIP PACKAGE AND METHOD INCLUDING ENCAPSULATING SPACED CHIPS BY LOCALLY CURABLE MATERIAL

InventorID:

6681491 ⎘