Sameer Paital

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2025-04-03

Top Assignees for applications by Sameer Paital

The entities that hold a legal rights for patent applications filed by inventor Paital Sameer:

Sameer Paital from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS.

ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES

InventorID:

6712269 ⎘