Cheng Sim Kee

City:

Bayan Lepas

Country:

Malaysia

Published Applications:

Last publication date:

2014-03-06

Top Assignees for applications by Cheng Sim Kee

The entities that hold a legal rights for patent applications filed by inventor Kee Cheng Sim:

Cheng Sim Kee from Bayan Lepas, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-Chip Module and Method of Manufacture

DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

InventorID:

672332 ⎘