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Inventor profile of:

Nicolas Heuck

City:

Cremlingen

Country:

Germany

Published Applications:

5

Last publication date:

2016-12-01

Top Assignees for applications by Nicolas Heuck

The entities that hold a legal rights for patent applications filed by inventor Heuck Nicolas:

  • INFINEON TECHNOLOGIES AG 4 Neubiberg, Germany

Recent patent applications by Heuck Nicolas

Nicolas Heuck from Cremlingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-12-01
US20160351533A1
Electricity

Method for producing an integral join and automatic placement machine

#2 | 2016-08-04
US20160225735A1
Electricity

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

#3 | 2016-05-26
US20160148819A1
Electricity

Method for producing a material-bonding connection between a semiconductor chip and a metal layer

#4 | 2015-09-10
US20150257280A1
Electricity

METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SINTERING CONNECTION, METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE AND CONTINUOUS INSTALLATION

#5 | 2014-03-06
US20140061909A1
Electricity

Pre-sintered semiconductor die structure

InventorID:

672351 ⎘

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