Dale A. Hackitt

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2014-03-06

Top Assignees for applications by Dale A. Hackitt

The entities that hold a legal rights for patent applications filed by inventor Hackitt Dale A.:

Dale A. Hackitt from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Ultra slim RF package for ultrabooks and smart phones

Microelectronic package having solder-filled through-vias

Backside via formation prior to die attachment

InventorID:

673219 ⎘