Gyeonggi-do
South Korea
16
2025-06-05
The entities that hold a legal rights for patent applications filed by inventor Kim Ji Eun:
Ji Eun Kim from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
BANKING PROCESSING METHOD AND COMPUTER-READABLE STORAGE MEDIUM HAVING APPLICATION FOR BANKING PROCESSING STORED THEREIN
#2 | 2024-11-14ANTISENSE COMPOUND FOR MODULATING WFDC2 EXPRESSION
#3 | 2022-11-17MELANOPHILIN ANTISENSE OLIGONUCLEOTIDES
#4 | 2022-08-25Semiconductor memory device with column path control circuit that controls column path for accessing a core circuit with multiple bank groups and column path control circuit therefor
#5 | 2022-06-23PHOTORESIST COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#6 | 2021-01-28Banking processing method and computer-readable storage medium having application for banking processing stored therein
#7 | 2020-10-08A feed composition for preventing or treating acute hepatopancreatic necrosis disease (AHPND) or white spot syndrome (WSS), comprising a Bacillus subtilis strain as an active ingredient
#8 | 2020-10-08Feed composition for preventing or treating acute hepatopancreatic necrosis disease (AHPND) or white spot syndrome (WSS), comprising a strain, a strain, and a strain as active ingredients
#9 | 2018-01-18PHOTOGRAPHIC LENS AND PHOTOGRAPHIC APPARATUS INCLUDING THE SAME
#10 | 2016-07-07ELECTRONIC DEVICE AND METHOD FOR PROVIDING WORKOUT SERVICE IN ELECTRONIC DEVICE
#11 | 2014-03-06Lens assembly and optical system including the same
#12 | 2011-08-04WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS
#13 | 2010-04-15WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS
#14 | 2009-06-04Flip chip package and method for manufacturing the same
#15 | 2009-02-26Semiconductor packaging method
#16 | 2007-06-14Method of manufacturing printed circuit board having landless via hole
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