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Inventor profile of:

Junho Yoon

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2026-05-28

Top Assignees for applications by Junho Yoon

The entities that hold a legal rights for patent applications filed by inventor Yoon Junho:

SAMSUNG ELECTRONICS CO., LTD. 14 Suwon-si, South Korea
Samsung Electronics Co., Ltd 3 , South Korea
Samsung Electronics Co., Ltd. 1 Yeongtong-Gu, Suwon-si, Gyeonggi-Do, South Korea

Recent patent applications by Yoon Junho

Junho Yoon from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-28

US20260150688A1

Electricity

SEMICONDUCTOR PACKAGE

#2 | 2026-04-09

US20260101522A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#3 | 2026-01-15

US20260016759A1

Physics

SEMICONDUCTOR PROCESS APPARATUS

#4 | 2026-01-01

US20260003299A1

Physics

SUBSTRATE STRUCTURE

#5 | 2025-11-20

US20250357413A1

Electricity

SEMICONDUCTOR PACKAGE

#6 | 2025-10-16

US20250323087A1

Electricity

SUBSTRATE PROCESSING APPARATUS

#7 | 2025-08-07

US20250249487A1

Performing operations; transporting

METHOD OF PROCESSING SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME

#8 | 2025-07-17

US20250232986A1

Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#9 | 2025-07-03

US20250218810A1

Electricity

SUBSTRATE DRYING APPARATUS AND SUBSTRATE DRYING METHOD

#10 | 2025-05-22

US20250167012A1

Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

#11 | 2025-04-17

US20250125197A1

Electricity

SEMICONDUCTOR CHIP

#12 | 2025-04-17

US20250125160A1

Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#13 | 2025-04-10

US20250120194A1

Electricity

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

#14 | 2025-02-06

US20250046747A1

Electricity

SEMICONDUCTOR PACKAGE

#15 | 2024-10-24

US20240355678A1

Electricity

METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY

#16 | 2024-05-30

US20240178000A1

Electricity

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME

#17 | 2024-02-01

US20240038493A1

Electricity

SEMICONDUCTOR PROCESSING APPARATUS

#18 | 2023-12-07

US20230395547A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#19 | 2020-11-26

US20200373124A1

Electricity

SEMICONDUCTOR PROCESSING APPARATUS

#20 | 2018-03-29

US20180090303A1

Electricity

Monitoring units, plasma treatment devices including the same, and methods of fabricating semiconductor devices using the same

#21 | 2017-02-16

US20170047257A1

Electricity

Methods for manufacturing a semiconductor device

#22 | 2016-10-27

US20160314981A1

Electricity

METHODS FOR FORMING PATTERN USING CYCLIC PROCESSING

#23 | 2016-10-06

US20160293445A1

Electricity

Method of forming fine pattern of semiconductor device

#24 | 2016-03-31

US20160093686A1

Electricity

Semiconductor devices including a support for an electrode and methods of forming semiconductor devices including a support for an electrode

#25 | 2015-03-19

US20150079791A1

Electricity

Method of fabricating semiconductor devices

#26 | 2014-03-06

US20140065785A1

Electricity

Semiconductor devices including a support for an electrode and methods of forming semiconductor devices including a support for an electrode

#27 | 2014-03-06

US20140065784A1

Electricity

Methods of fabricating a semiconductor device with capacitors using mold structure and protection layer

InventorID:

677097 ⎘