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Inventor profile of:

Tetsuya ISHIWATA

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2024-10-03

Top Assignees for applications by Tetsuya ISHIWATA

The entities that hold a legal rights for patent applications filed by inventor ISHIWATA Tetsuya:

Ebara Corporation 1 Tokyo, Japan

Recent patent applications by ISHIWATA Tetsuya

Tetsuya ISHIWATA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-03

US20240328422A1

Mechanical engineering

PUMP CASING AND PUMP

InventorID:

6796901 ⎘