Austin, Texas
United States
10
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor WANG Liwei:
Liwei WANG from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT DIE STACK WITH A BACK-SIDE POWER DELIVERY NETWORK
#2 | 2026-03-12SYSTEMS AND METHODS FOR LATERAL STACKING OF DIE
#3 | 2025-09-18SYSTEMS AND METHODS FOR PACKAGING A SEMICONDUCTOR DEVICE
#4 | 2025-07-31INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
#5 | 2025-07-31INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE
#6 | 2025-05-22INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
#7 | 2025-04-03CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
#8 | 2025-03-20HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGRATED PASSIVE DEVICES
#9 | 2025-03-20METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGRATED PASSIVE DEVICES
#10 | 2024-12-05CHIP COMPLEX WITH EMBEDDED INTERPOSER
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