Benjamin Clay Bradley

City:

Kalispell, Montana

Country:

United States

Published Applications:

Last publication date:

2026-01-22

Top Assignees for applications by Benjamin Clay Bradley

The entities that hold a legal rights for patent applications filed by inventor Bradley Benjamin Clay:

Applied Materials, Inc. 2 Santa Clara, CA United States

Recent patent applications by Bradley Benjamin Clay

Benjamin Clay Bradley from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-22

US20260026286A1

Electricity

ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT

#2 | 2025-01-02

US20250006519A1

Electricity

ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT

InventorID:

6889702 ⎘