Suwon-si
South Korea
10
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor Lee Jaesic:
Jaesic Lee from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
HIGH BANDWIDTH MEMORY AND METHOD FOR MANUFACTURING THE SAME
#2 | 2025-07-17SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING THE SAME
#3 | 2025-05-22SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4 | 2025-05-08SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#5 | 2025-03-13SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
#6 | 2025-02-06SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADER AND A METHOD OF FABRICATING THE SAME
#7 | 2025-01-23SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#8 | 2025-01-16SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#9 | 2025-01-16SEMICONDUCTOR PACKAGE
#10 | 2025-01-02SEMICONDUCTOR PACKAGE
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