Phoenix, Arizona
United States
36
2025-10-16
The entities that hold a legal rights for patent applications filed by inventor SANKMAN Robert:
Robert SANKMAN from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
NESTED INTERPOSER PACKAGE FOR IC CHIPS
#2 | 2025-09-18SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS
#3 | 2025-06-19HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
#4 | 2024-07-11SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS
#5 | 2024-05-02INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
#6 | 2024-04-18Heterogeneous nested interposer package for IC chips
#7 | 2024-02-01Heterogeneous nested interposer package for IC chips
#8 | 2023-08-10EMIB patch on glass laminate substrate
#9 | 2023-06-22Programmable logic device with fine-grained disaggregation
#10 | 2023-05-04Semiconductor device stack-up with bulk substrate material to mitigate hot spots
#11 | 2023-05-04Heterogeneous nested interposer package for IC chips
#12 | 2023-04-06Interconnect architecture with silicon interposer and EMIB
#13 | 2021-10-21Programmable logic device with fine-grained disaggregation
#14 | 2021-01-28Semiconductor device stack-up with bulk substrate material to mitigate hot spots
#15 | 2021-01-14Package on active silicon semiconductor packages
#16 | 2021-01-07NESTED INTERPOSER PACKAGE FOR IC CHIPS
#17 | 2020-12-24Connectivity between integrated circuit dice in a multi-chip package
#18 | 2020-12-17Heterogeneous nested interposer package for IC chips
#19 | 2020-12-03Thermal solutions for multi-package assemblies and methods for fabricating the same
#20 | 2020-11-12Disaggregated die interconnection with on-silicon cavity bridge
#21 | 2020-11-12Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling
#22 | 2020-10-15Liquid cooling through conductive interconnect
#23 | 2020-09-24EMIB patch on glass laminate substrate
#24 | 2020-07-30In-package 3D antenna
#25 | 2020-07-02Interconnect architecture with silicon interposer and EMIB
#26 | 2020-06-11Programmable logic device with fine-grained disaggregation
#27 | 2020-03-12Programmable logic device with fine-grained disaggregation
#28 | 2020-01-02INTEGRATED HETEROGENOUS POWER MANAGEMENT CIRCUITRIES
#29 | 2020-01-02Chip scale thin 3D die stacked package
#30 | 2019-07-04Substrate assembly with magnetic feature
#31 | 2019-06-27Electromagnetic interference shields for electronic packages and related methods
#32 | 2018-01-11Electromagnetic interference shields for electronic packages and related methods
#33 | 2017-06-22Electromagnetic interference shields for electronic packages and related methods
#34 | 2016-08-25Method of making an accelerometer
#35 | 2014-03-20Techniques, systems and devices related to acceleration measurement
#36 | 2005-12-01Method and apparatus for providing distributed fluid flows in a thermal management arrangement
690110 ⎘