Aloha, Oregon
United States
77
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor Bohr Mark:
Mark Bohr from Aloha, US has applied for patents for these inventions. The list has both pending applications and granted patents:
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
#2 | 2025-07-17GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
#3 | 2024-03-21DEVICE LAYER INTERCONNECTS
#4 | 2023-08-03DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FOR HIGH PERFORMANCE MICROPROCESSORS
#5 | 2023-06-08SELF-ALIGNED GATE EDGE AND LOCAL INTERCONNECT
#6 | 2022-10-06Device layer interconnects
#7 | 2022-09-22Device, system and method for providing inductor structures
#8 | 2022-09-08Deep trench via for three-dimensional integrated circuit
#9 | 2022-08-25Device, method and system for providing a stacked arrangement of integrated circuit dies
#10 | 2022-04-14COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
#11 | 2022-02-24DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#12 | 2021-07-08Gate contact structure over active gate and method to fabricate same
#13 | 2021-03-25High density and fine pitch interconnect structures in an electric test apparatus
#14 | 2021-03-11Device, method and system for providing a stacked arrangement of integrated circuit dies
#15 | 2021-01-14Package on active silicon semiconductor packages
#16 | 2020-12-24Substrate-less FinFET diode architectures with backside metal contact and subfin regions
#17 | 2020-12-10Self-aligned gate edge and local interconnect
#18 | 2020-08-13Device, system and method for providing inductor structures
#19 | 2020-07-02Die interconnection scheme for providing a high yielding process for high performance microprocessors
#20 | 2020-04-30RANDOM-ACCESS MEMORY WITH LOADED CAPACITANCE
#21 | 2020-04-02Integrated circuit structures having asymmetric source and drain structures
#22 | 2020-02-20STRUCTURES AND METHODS FOR LARGE INTEGRATED CIRCUIT DIES
#23 | 2020-01-23High density and fine pitch interconnect structures in an electric test apparatus
#24 | 2019-12-12Deep trench via for three-dimensional integrated circuit
#25 | 2019-12-12Device layer interconnects
#26 | 2019-10-24Self-aligned gate edge and local interconnect
#27 | 2019-07-11High density and fine pitch interconnect structures in an electric test apparatus
#28 | 2019-06-27Designs and methods for conductive bumps
#29 | 2019-04-18Gate contact structure over active gate and method to fabricate same
#30 | 2018-02-15Self-aligned gate edge and local interconnect and method to fabricate same
#31 | 2017-09-14COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
#32 | 2017-03-23Designs and methods for conductive bumps
#33 | 2017-01-05Gate contact structure over active gate and method to fabricate same
#34 | 2016-08-11Self-aligned gate edge and local interconnect and method to fabricate same
#35 | 2015-07-02COMPOSITE MATERIALS FOR USE IN SEMICONDUCTOR COMPONENTS
#36 | 2014-09-18COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
#37 | 2014-03-20Gate contact structure over active gate and method to fabricate same
#38 | 2012-11-29Copper-filled trench contact for transistor performance improvement
#39 | 2011-06-30Selective spacer formation on transistors of different classes on the same device
#40 | 2011-05-31Silicon interposer-based hybrid voltage regulator system for VLSI devices
#41 | 2011-04-14Designs and methods for conductive bumps
#42 | 2010-06-17Forming abrupt source drain metal gate transistors
#43 | 2009-07-30Selective spacer formation on transistors of different classes on the same device
#44 | 2009-03-31LOCOS isolation for fully-depleted SOI devices
#45 | 2008-09-25Copper die bumps with electromigration cap and plated solder
#46 | 2008-09-04Designs and methods for conductive bumps
#47 | 2008-08-19Super self-aligned collector device for mono-and hetero bipolar junction transistors, and method of making same
#48 | 2008-05-22Microcircuit fabrication and interconnection
#49 | 2008-05-22Forming self-aligned nano-electrodes
#50 | 2008-01-03Selective spacer formation on transistors of different classes on the same device
#51 | 2007-11-29Copper-filled trench contact for transistor performance improvement
#52 | 2007-06-14Strained silicon MOS device with box layer between the source and drain regions
#53 | 2007-06-14Active region spacer for semiconductor devices and method to form the same
#54 | 2007-06-14Isolation body for semiconductor devices and method to form the same
#55 | 2007-04-10Self aligned compact bipolar junction transistor layout and method of making same
#56 | 2007-03-29Methods of forming electromigration and thermal gradient based fuse structures
#57 | 2006-11-23Methods of forming electromigration and thermal gradient based fuse structures
#58 | 2006-09-19Self-aligned contacts to gates
#59 | 2006-08-15Self-aligned contacts to gates
#60 | 2006-06-20Self aligned compact bipolar junction transistor layout, and method of making same
#61 | 2006-06-01Bipolar junction transistor with improved extrinsic base region and method of fabrication
#62 | 2006-05-11Interconnect shunt used for current distribution and reliability redundancy
#63 | 2006-03-21Super self-aligned collector device for mono-and hetero bipolar junction transistors and method of making same
#64 | 2006-03-02Method of forming abrupt source drain metal gate transistors
#65 | 2006-03-02Transistor performance enhancement using engineered strains
#66 | 2006-01-05Interconnect shunt used for current distribution and reliability redundancy
#67 | 2005-12-29Transistors with increased mobility in the channel zone and method of fabrication
#68 | 2005-11-17Stepped tip junction with spacer layer
#69 | 2005-10-13Forming self-aligned nano-electrodes
#70 | 2005-08-23Microcircuit fabrication and interconnection
#71 | 2005-08-04Microcircuit fabrication and interconnection
#72 | 2005-07-28Concentration graded carbon doped oxide
#73 | 2005-07-19Silicon on insulator (SOI) transistor and methods of fabrication
#74 | 2005-07-07Damascene process for fabricating interconnect layers in an integrated circuit
#75 | 2005-05-19Bipolar junction transistor with improved extrinsic base region and method of fabrication
#76 | 2005-05-03Concentration graded carbon doped oxide
#77 | 2005-03-24Designs and methods for conductive bumps
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