Inventor profile of:

Mark Bohr

City:

Aloha, Oregon

Country:

United States

Published Applications:

77

Last publication date:

2026-01-22

Top Assignees for applications by Mark Bohr

The entities that hold a legal rights for patent applications filed by inventor Bohr Mark:

Recent patent applications by Bohr Mark

Mark Bohr from Aloha, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-22
US20260026325A1
Electricity

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

#2 | 2025-07-17
US20250233020A1
Electricity

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

#3 | 2024-03-21
US20240096791A1
Electricity

DEVICE LAYER INTERCONNECTS

#4 | 2023-08-03
US20230245974A1
Electricity

DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FOR HIGH PERFORMANCE MICROPROCESSORS

#5 | 2023-06-08
US20230178594A1
Electricity

SELF-ALIGNED GATE EDGE AND LOCAL INTERCONNECT

#6 | 2022-10-06
US20220319978A1
Electricity

Device layer interconnects

#7 | 2022-09-22
US20220302051A1
Electricity

Device, system and method for providing inductor structures

#8 | 2022-09-08
US20220285342A1
Electricity

Deep trench via for three-dimensional integrated circuit

#9 | 2022-08-25
US20220271022A1
Electricity

Device, method and system for providing a stacked arrangement of integrated circuit dies

#10 | 2022-04-14
US20220115505A1
Electricity

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

#11 | 2022-02-24
US20220059484A1
Electricity

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

#12 | 2021-07-08
US20210210385A1
Electricity

Gate contact structure over active gate and method to fabricate same

#13 | 2021-03-25
US20210088554A1
Physics

High density and fine pitch interconnect structures in an electric test apparatus

#14 | 2021-03-11
US20210074695A1
Electricity

Device, method and system for providing a stacked arrangement of integrated circuit dies

#15 | 2021-01-14
US20210013188A1
Electricity

Package on active silicon semiconductor packages

#16 | 2020-12-24
US20200403007A1
Electricity

Substrate-less FinFET diode architectures with backside metal contact and subfin regions

#17 | 2020-12-10
US20200388675A1
Electricity

Self-aligned gate edge and local interconnect

#18 | 2020-08-13
US20200258852A1
Electricity

Device, system and method for providing inductor structures

#19 | 2020-07-02
US20200211970A1
Electricity

Die interconnection scheme for providing a high yielding process for high performance microprocessors

#20 | 2020-04-30
US20200135266A1
Physics

RANDOM-ACCESS MEMORY WITH LOADED CAPACITANCE

#21 | 2020-04-02
US20200105759A1
Electricity

Integrated circuit structures having asymmetric source and drain structures

#22 | 2020-02-20
US20200058646A1
Electricity

STRUCTURES AND METHODS FOR LARGE INTEGRATED CIRCUIT DIES

#23 | 2020-01-23
US20200025801A1
Physics

High density and fine pitch interconnect structures in an electric test apparatus

#24 | 2019-12-12
US20190378836A1
Electricity

Deep trench via for three-dimensional integrated circuit

#25 | 2019-12-12
US20190378790A1
Electricity

Device layer interconnects

#26 | 2019-10-24
US20190326391A1
Electricity

Self-aligned gate edge and local interconnect

#27 | 2019-07-11
US20190212366A1
Physics

High density and fine pitch interconnect structures in an electric test apparatus

#28 | 2019-06-27
US20190198472A1
Electricity

Designs and methods for conductive bumps

#29 | 2019-04-18
US20190115257A1
Electricity

Gate contact structure over active gate and method to fabricate same

#30 | 2018-02-15
US20180047808A1
Electricity

Self-aligned gate edge and local interconnect and method to fabricate same

#31 | 2017-09-14
US20170263721A1
Electricity

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

#32 | 2017-03-23
US20170084564A1
Electricity

Designs and methods for conductive bumps

#33 | 2017-01-05
US20170004998A1
Electricity

Gate contact structure over active gate and method to fabricate same

#34 | 2016-08-11
US20160233298A1
Electricity

Self-aligned gate edge and local interconnect and method to fabricate same

#35 | 2015-07-02
US20150187900A1
Electricity

COMPOSITE MATERIALS FOR USE IN SEMICONDUCTOR COMPONENTS

#36 | 2014-09-18
US20140264879A1
Electricity

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

#37 | 2014-03-20
US20140077305A1
Electricity

Gate contact structure over active gate and method to fabricate same

#38 | 2012-11-29
US20120299069A1
Electricity

Copper-filled trench contact for transistor performance improvement

#39 | 2011-06-30
US20110157854A1
Electricity

Selective spacer formation on transistors of different classes on the same device

#40 | 2011-05-31
US10016793
-

Silicon interposer-based hybrid voltage regulator system for VLSI devices

#41 | 2011-04-14
US20110084387A1
Electricity

Designs and methods for conductive bumps

#42 | 2010-06-17
US20100151669A1
Electricity

Forming abrupt source drain metal gate transistors

#43 | 2009-07-30
US20090189193A1
Electricity

Selective spacer formation on transistors of different classes on the same device

#44 | 2009-03-31
US10330842
-

LOCOS isolation for fully-depleted SOI devices

#45 | 2008-09-25
US20080230896A1
Electricity

Copper die bumps with electromigration cap and plated solder

#46 | 2008-09-04
US20080213996A1
Electricity

Designs and methods for conductive bumps

#47 | 2008-08-19
US10633055
-

Super self-aligned collector device for mono-and hetero bipolar junction transistors, and method of making same

#48 | 2008-05-22
US20080119016A1
Electricity

Microcircuit fabrication and interconnection

#49 | 2008-05-22
US20080116439A1
Electricity

Forming self-aligned nano-electrodes

#50 | 2008-01-03
US20080003746A1
Electricity

Selective spacer formation on transistors of different classes on the same device

#51 | 2007-11-29
US20070273042A1
Electricity

Copper-filled trench contact for transistor performance improvement

#52 | 2007-06-14
US20070134859A1
Electricity

Strained silicon MOS device with box layer between the source and drain regions

#53 | 2007-06-14
US20070132057A1
Electricity

Active region spacer for semiconductor devices and method to form the same

#54 | 2007-06-14
US20070132034A1
Electricity

Isolation body for semiconductor devices and method to form the same

#55 | 2007-04-10
US10418395
-

Self aligned compact bipolar junction transistor layout and method of making same

#56 | 2007-03-29
US20070069331A1
Electricity

Methods of forming electromigration and thermal gradient based fuse structures

#57 | 2006-11-23
US20060261437A1
Electricity

Methods of forming electromigration and thermal gradient based fuse structures

#58 | 2006-09-19
US10714466
-

Self-aligned contacts to gates

#59 | 2006-08-15
US10714138
-

Self-aligned contacts to gates

#60 | 2006-06-20
US10877749
-

Self aligned compact bipolar junction transistor layout, and method of making same

#61 | 2006-06-01
US20060113634A1
Electricity

Bipolar junction transistor with improved extrinsic base region and method of fabrication

#62 | 2006-05-11
US20060097375A1
Electricity

Interconnect shunt used for current distribution and reliability redundancy

#63 | 2006-03-21
US10632944
-

Super self-aligned collector device for mono-and hetero bipolar junction transistors and method of making same

#64 | 2006-03-02
US20060046399A1
Electricity

Method of forming abrupt source drain metal gate transistors

#65 | 2006-03-02
US20060043579A1
Electricity

Transistor performance enhancement using engineered strains

#66 | 2006-01-05
US20060001178A1
Electricity

Interconnect shunt used for current distribution and reliability redundancy

#67 | 2005-12-29
US20050285212A1
Electricity

Transistors with increased mobility in the channel zone and method of fabrication

#68 | 2005-11-17
US20050253192A1
Electricity

Stepped tip junction with spacer layer

#69 | 2005-10-13
US20050224778A1
Electricity

Forming self-aligned nano-electrodes

#70 | 2005-08-23
US10336236
-

Microcircuit fabrication and interconnection

#71 | 2005-08-04
US20050167755A1
Electricity

Microcircuit fabrication and interconnection

#72 | 2005-07-28
US20050161827A1
Electricity

Concentration graded carbon doped oxide

#73 | 2005-07-19
US10208890
-

Silicon on insulator (SOI) transistor and methods of fabrication

#74 | 2005-07-07
US20050148190A1
Electricity

Damascene process for fabricating interconnect layers in an integrated circuit

#75 | 2005-05-19
US20050104160A1
Electricity

Bipolar junction transistor with improved extrinsic base region and method of fabrication

#76 | 2005-05-03
US9943874
-

Concentration graded carbon doped oxide

#77 | 2005-03-24
US20050062169A1
Electricity

Designs and methods for conductive bumps

InventorID:

691679 ⎘