Andre Rainer STEGNER

City:

Ottobrunn

Country:

Germany

Published Applications:

Last publication date:

2025-03-06

Top Assignees for applications by Andre Rainer STEGNER

The entities that hold a legal rights for patent applications filed by inventor STEGNER Andre Rainer:

INFINEON TECHNOLOGIES AG 1 Neubiberg, Germany

Recent patent applications by STEGNER Andre Rainer

Andre Rainer STEGNER from Ottobrunn, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-03-06

US20250079275A1

Electricity

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTURE AND WITH THERMALLY CONDUCTIVE ELECTRICALLY INSULATING LAYER

InventorID:

6951405 ⎘