John Wuu

City:

Ft. Collins, Colorado

Country:

United States

Published Applications:

Last publication date:

2025-06-26

Top Assignees for applications by John Wuu

The entities that hold a legal rights for patent applications filed by inventor Wuu John:

Advanced Micro Devices, Inc. 9 Santa Clara, CA United States

Recent patent applications by Wuu John

John Wuu from Ft. Collins, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-26

US20250210591A1

Electricity

APPARATUS, SYSTEM, AND METHOD FOR BALANCING TIMING CLOSURE

#2 | 2025-06-26

US20250210557A1

Electricity

COMPONENT PITCH REALIGNMENT FROM BOND PAD METAL PITCH

#3 | 2025-06-26

US20250210538A1

Electricity

APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL DIES ACROSS DIE STACKS

#4 | 2025-06-26

US20250210497A1

Electricity

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

#5 | 2025-06-19

US20250201637A1

Electricity

DEVICES AND METHODS FOR TESTING DIES WITH OFF-DIE CLOCKS

#6 | 2025-06-19

US20250199068A1

Physics

APPARATUS, SYSTEM, AND METHOD FOR DISTRIBUTING DIE-SPECIFIC SIGNALS ACROSS DIE STACKS

#7 | 2025-06-05

US20250183226A1

Electricity

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

#8 | 2025-05-29

US20250174985A1

Electricity

APPARATUS, SYSTEM, AND METHOD FOR REDUCING THE FOOTPRINTS OF CIRCUITS THAT PROTECT AGAINST THE ANTENNA EFFECT AND ELECTROSTATIC DISCHARGE

#9 | 2025-04-03

US20250112047A1

Electricity

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

InventorID:

6979466 ⎘