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Inventor profile of:

Andrew JIMENEZ

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2026-03-26

Top Assignees for applications by Andrew JIMENEZ

The entities that hold a legal rights for patent applications filed by inventor JIMENEZ Andrew:

INTEL CORPORATION 5 Santa Clara, CA United States

Recent patent applications by JIMENEZ Andrew

Andrew JIMENEZ from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-26

US20260090433A1

Electricity

3D PRINTING OF GLASS CORE EDGE PROTECTION IN IC DEVICE PACKAGING

#2 | 2026-01-01

US20260005160A1

Electricity

HYBRID PANEL WITH A GLASS SUBSTRATE

#3 | 2026-01-01

US20260005159A1

Electricity

RECONSTITUTED GLASS PANEL FOR HYBRID PANEL MANUFACTURING

#4 | 2026-01-01

US20260005078A1

Electricity

FABRICATING INTEGRATED CIRCUIT PACKAGES WITH GLASS CORE HYBRID PANELS

#5 | 2026-01-01

US20260005042A1

Electricity

SYSTEM AND METHOD FOR SINGULATION OF SEMICONDUCTOR WORKPIECE

#6 | 2025-12-25

US20250391720A1

Electricity

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES

#7 | 2025-12-25

US20250391717A1

Electricity

MICROELECTRONIC ASSEMBLIES WITH STACKS OF GLASS LAYERS

#8 | 2025-12-25

US20250391715A1

Electricity

MICROELECTRONIC ASSEMBLIES WITH GLASS CORES WITH OUTER FRAMES AND METAL PILLARS

#9 | 2025-07-03

US20250218953A1

Electricity

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THROUGH SILICON VIAS IN SUBSTRATES

#10 | 2025-05-08

US20250144857A1

Performing operations; transporting

MOLDING SYSTEM AND MOLDING METHOD

#11 | 2025-04-03

US20250112136A1

Electricity

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

InventorID:

6979515 ⎘