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Inventor profile of:

Siegfried Hoffner

City:

Nesselwang

Country:

Germany

Published Applications:

7

Last publication date:

2020-02-27

Top Assignees for applications by Siegfried Hoffner

The entities that hold a legal rights for patent applications filed by inventor Hoffner Siegfried:

  • INFINEON TECHNOLOGIES AG 5 Neubiberg, Germany

Recent patent applications by Hoffner Siegfried

Siegfried Hoffner from Nesselwang, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-02-27
US20200065641A1
Physics

METAL CHIP CARD BODY

#2 | 2018-02-01
US20180032854A1
Physics

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

#3 | 2017-08-31
US20170246844A1
Performing operations; transporting

CHIP CARD SUBSTRATE AND METHOD OF FORMING A CHIP CARD SUBSTRATE

#4 | 2017-07-20
US20170206448A1
Physics

Chip card and method of forming a chip card

#5 | 2015-10-08
US20150286921A1
Physics

CHIP CARD SUBSTRATE AND METHOD OF FORMING A CHIP CARD SUBSTRATE

#6 | 2015-10-08
US20150283794A1
Performing operations; transporting

Chip card substrate and method of forming a chip card substrate

#7 | 2014-03-27
US20140084070A1
Physics

CHIP CARD AND METHOD FOR MANUFACTURING A CHIP CARD

InventorID:

699994 ⎘

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