Cheonan-si
South Korea
7
2014-03-27
The entities that hold a legal rights for patent applications filed by inventor Son Dae-Woo:
Dae-Woo Son from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor chip and film and tab package comprising the chip and film
#2 | 2012-01-26METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICATING CHIP PACKAGE INCLUDING THE SAME
#3 | 2011-09-01Semiconductor chip and film and TAB package comprising the chip and film
#4 | 2011-06-16Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
#5 | 2010-01-07Semiconductor package
#6 | 2009-11-05Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
#7 | 2005-05-05Tape circuit substrate and semiconductor apparatus employing the same
700405 ⎘