Phoenix, Arizona
United States
29
2025-10-16
The entities that hold a legal rights for patent applications filed by inventor Starkston Robert:
Robert Starkston from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
#2 | 2024-12-19LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
#3 | 2023-04-27Localized high density substrate routing
#4 | 2023-02-09Localized high density substrate routing
#5 | 2021-12-09Hybrid microelectronic substrates
#6 | 2021-07-01SYSTEM AND METHOD FOR STACKING WIRE-BOND CONVERTED FLIP-CHIP DIE
#7 | 2020-12-17Localized high density substrate routing
#8 | 2020-10-22Hybrid microelectronic substrate and methods for fabricating the same
#9 | 2019-12-26Coupling a magnet with a MEMS device
#10 | 2019-02-21Hybrid microelectronic substrate and methods for fabricating the same
#11 | 2019-02-21Hybrid microelectronic substrates
#12 | 2018-12-06Localized high density substrate routing
#13 | 2018-11-29Hybrid microelectronic substrate and methods for fabricating the same
#14 | 2018-08-09Multi-die package
#15 | 2018-05-17Microelectromechanical system with spring for magnet placement
#16 | 2017-10-05Localized high density substrate routing
#17 | 2017-07-13Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#18 | 2016-09-15On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
#19 | 2016-07-07Localized high density substrate routing
#20 | 2016-03-31Panel level fabrication of package substrates with integrated stiffeners
#21 | 2015-11-26Localized high density substrate routing
#22 | 2015-06-04Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#23 | 2014-04-03Localized high density substrate routing
#24 | 2014-03-27Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#25 | 2010-11-04Methods and apparatus for laser scribing wafers
#26 | 2007-01-04Soldering a die to a substrate
#27 | 2005-11-17Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#28 | 2005-09-22Marking on underfill
#29 | 2005-03-31Methods for laser scribing wafers
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