Chandler, Arizona
United States
23
2025-10-16
The entities that hold a legal rights for patent applications filed by inventor Kulkarni Deepak:
Deepak Kulkarni from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
#2 | 2025-08-07CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS
#3 | 2024-12-19LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
#4 | 2024-07-25Chiplet first architecture for die tiling applications
#5 | 2023-10-26TECHNIQUES FOR DIE TILING
#6 | 2023-04-27Localized high density substrate routing
#7 | 2023-02-09Localized high density substrate routing
#8 | 2022-07-28TECHNIQUES FOR DIE TILING
#9 | 2022-07-28Chiplet first architecture for die tiling applications
#10 | 2022-06-23NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF METAL DEFINED PADS
#11 | 2022-04-14TECHNIQUES FOR DIE TILING
#12 | 2022-04-14Chiplet first architecture for die tiling applications
#13 | 2020-12-17Localized high density substrate routing
#14 | 2020-08-13Chiplet first architecture for die tiling applications
#15 | 2019-10-10TECHNIQUES FOR DIE TILING
#16 | 2018-12-06Localized high density substrate routing
#17 | 2017-10-05Localized high density substrate routing
#18 | 2016-07-07Localized high density substrate routing
#19 | 2016-01-28Bumpless build-up layer package including an integrated heat spreader
#20 | 2015-11-26Localized high density substrate routing
#21 | 2015-04-16Bumpless build-up layer package including an integrated heat spreader
#22 | 2014-04-03Localized high density substrate routing
#23 | 2014-04-03Bumpless build-up layer package including an integrated heat spreader
709350 ⎘