Tempe, Arizona
United States
5
2016-06-30
The entities that hold a legal rights for patent applications filed by inventor Andideh Ebrahim:
Ebrahim Andideh from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Formation of dielectric with smooth surface
#2 | 2015-12-10Methods of providing dielectric to conductor adhesion in package structures
#3 | 2014-12-04FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
#4 | 2014-09-18Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
#5 | 2014-04-03Methods of providing dielectric to conductor adhesion in package structures
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