Ronilo Boja

City:

Gilroy, California

Country:

United States

Published Applications:

Last publication date:

2025-11-06

Top Assignees for applications by Ronilo Boja

The entities that hold a legal rights for patent applications filed by inventor Boja Ronilo:

Ronilo Boja from Gilroy, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Hybrid Material Lid, Heat Sink, or Cold Plate for Semiconductor Packages

Chip package having a cover with window

Chip package assembly with composite stiffener

Chip package assembly with surface mounted component protection

InventorID:

7115315 ⎘